TE28F128J3A-150
Intel StrataFlash Memory (J3)

Part Number:
Quantity:
Country/Region:
Email:
Description:
Code:
For complete your requirements, please fill in the part number,quantity and other contact details. So that more suppliers will contact you.
  Supplier Information Part Number Mfg Pack D/C Description Inquire

TE202122203 4 Mbit (256Kb x16) UV EPROM and OTP EPROM TE2024C Black Surface Seven Segment Displays
TE2045A-D3-20 Dual LDO with Low Noise, Low IQ, and High PSRR TE20-4C104JT 220 Small Outline Dual-In-Line Thick Film Surface Mount Resistor Networks
TE215N10E SPECIFICATIONS FOR LCD MODULE TE2221(147B) MEMORY SPECTRUM
TE23656 8K SPI Bus Serial EEPROM TE23F16 CHIP TYPE, EXTRA LOW IMPEDANCE
TE24.0164 THYRISTOR MODULE TE2412-P128G-09 Thyristor Modules
TE2-50V102M 7.6 mm (0.3 inch)/10.9 mm (0.43 inch) Seven Segment Displays TE2548 30V N-Channel PowerTrench MOSFET
TE2573 2.50mm PITCH CONNECTOR TE25V332M SPECIFICATIONS FOR LCD MODULE
TE26.1758 TE28016C3TD110 General Purpose EMI Reduction IC
TE28128J3A-150 UProcessor Supervisory TE28128J3C-150
TE28128J3D75 TE28160C3BA90

Datasheet

Size: 905.78KB
Page: 72
PDF: TE28F128J3A-150.pdf
  • Description:
    Intel StrataFlash Memory (J3)
  • MFG:
    INTEL [Intel Corporation]
 

Abstract


Intel StrataFlash
?
Memory (J3)
256-Mbit (x8/x16)
Datasheet
Product Features
Capitalizing on Intel’s 0.25 and 0.18 micron, two-bit-per-cell technology, the Intel StrataFlash
?
Memory (J3)
device provides 2X the bits in 1X the space, with new features for mainstream performance. Offered in 256-
Mbit (32-Mbyte), 128-Mbit (16-Mbyte), 64-Mbit, and 32-Mbit densities, the J3 device brings reliable, two-bit-
per-cell storage technology to the flash market segment. Benefits include more density in less space, high-speed
interface, lowest cost-per-bit NOR device, support for code and data storage, and easy migration to future
devices.
Using the same NOR-based ETOX? technology as Intel’s one-bit-per-cell products, the J3 device takes
advantage of over one billion units of flash manufacturing experience since 1987. As a result, J3 components
are ideal for code and data applications where high density and low cost are required. Examples include
networking, telecommunications, digital set top boxes, audio recording, and digital imaging.
By applying FlashFile? memory family pinouts, J3 memory components allow easy design migrations from
existing Word-Wide FlashFile memory (28F160S3 and 28F320S3), and first generation Intel StrataFlash
?

memory (28F640J5 and 28F320J5) devices.
J3 memory components deliver a new generation of forward-compatible software support. By using the
Common Flash Interface (CFI) and the Scalable Command Set (SCS), customers can take advantage of density
upgrades and optimized write capabilities of future Intel StrataFlash
?
memory devices. Manufactured on Intel
?

0.18 micron ETOX? VII (J3C) and 0.25 micron ETOX? VI (J3A) process technology, the J3 memory device
provides the highest levels of quality and reliability.
■ Performance
—110/115/120/150 ns Initial Access Speed
—125 ns Initial Access Speed (256 Mbit
density only)
—25 ns Asynchronous Page mode Reads
—30 ns Asynchronous Page mode Reads
(256Mbit density only)
—32-Byte Write Buffer
—6.8 ?s per byte effective
programming time
■ Software
—Program and Erase suspend support
—Flash Data Integrator (FDI), Common
Flash Interface (CFI) Compatible
■ Security
—128-bit Protection Register
—64-bit Unique Device Identifier
—64-bit User Programmable OTP Cells
—Absolute Protection with V
PEN
= GND
—Individual Block Locking
—Block Erase/Program Lockout during
Power Transitions
■ Architecture
—Multi-Level Cell Technology: High
Density at Low Cost
—High-Density Symmetrical 128-Kbyte
Blocks
—256 Mbit (256 Blocks) (0.18?m only)
—128 Mbit (128 Blocks)
—64 Mbit (64 Blocks)
—32 Mbit (32 Blocks)
■ Quality and Reliability
—Operating Temperature:
-40 °C to +85 °C
—100K Minimum Erase Cycles per Block
—0.18 ?m ETOX? VII Process (J3C)
—0.25 ?m ETOX? VI Process (J3A)
■ Packaging and Voltage
—56-Lead TSOP Package
—64-Ball Intel
?

Easy BGA Package
—Lead-free packages available
—48-Ball Intel
?

VF BGA Package (32 and
64 Mbit) (x16 only)
—V
CC =
2.7 V to 3.6 V
—V
CCQ
= 2.7 V to 3.6 V
Order Number: 290667-021
March 2005
Notice: This document contains information on new products in production. The specifications are
subject to change without notice. Verify with your local Intel sales office that you have the latest
datasheet before finalizing a design.

Stock Index : 0  1  2  3  4  5  6  7  8  9  A  B  C  D  E  F  G  H  I  J  K  L  M  N  O  P  Q  R  S  T  U  V  W  X  Y  Z  All  
About Us  |  Contact us   |  Map  |  Link   |  Custom PCB Prototype Manufacturer
© 2008-2011 TradeOfic.com Corp.All Rights Reserved.